Proceedings / CIPS 2008
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Conference Topics: 1. Power Electronics Systems Device and System Packaging, Assembly Concepts and System Integration Mechatronics – Integration of Power Electronics and Actuators Thermal Management Passive Integration Concepts Embedded Power Systems Electromagnetic Interference Advanced Filter Designs Technologies for High Temperature Applications New Materials and Components for Hybrid Integration Sensor and Driver Developments Design for Reliability – Virtual Qualification Design Methods and Tools Life Cycle Costs (LCC) – Cost Analysis, Maintenance, Repair, Recycling, System partitioning 2. High and Medium Power Modules Advanced Module Concepts System Partitioning 3. Monolithic Power Electronic System Integration Advanced Monolithic Power Electronic Systems Technologies for “Systems-on-Chip” SOI-Technologies Chip Interfacing Technologies (Bonding)
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Proceedings / CIPS 2008, Jacobus D. van Wyk
- Language
- Released
- 2008
Payment methods
- Title
- Proceedings / CIPS 2008
- Language
- English
- Authors
- Jacobus D. van Wyk
- Publisher
- VDE-Verl.
- Released
- 2008
- Format
- Paperback
- ISBN10
- 3800730898
- ISBN13
- 9783800730896
- Series
- ETG-Fachbericht
- Category
- University and college textbooks
- Description
- Conference Topics: 1. Power Electronics Systems Device and System Packaging, Assembly Concepts and System Integration Mechatronics – Integration of Power Electronics and Actuators Thermal Management Passive Integration Concepts Embedded Power Systems Electromagnetic Interference Advanced Filter Designs Technologies for High Temperature Applications New Materials and Components for Hybrid Integration Sensor and Driver Developments Design for Reliability – Virtual Qualification Design Methods and Tools Life Cycle Costs (LCC) – Cost Analysis, Maintenance, Repair, Recycling, System partitioning 2. High and Medium Power Modules Advanced Module Concepts System Partitioning 3. Monolithic Power Electronic System Integration Advanced Monolithic Power Electronic Systems Technologies for “Systems-on-Chip” SOI-Technologies Chip Interfacing Technologies (Bonding)