Focusing on advanced semiconductor technologies, this book delves into the intricacies of flip chip, hybrid bonding, and fan-out techniques. It emphasizes engineering practices while covering essential topics like wafer bumping, assembly processes, and reliability. Key discussions include chip-to-wafer bonding, various packaging methods such as WLCSP and FOWLP, and the integration of optics with chiplets. The comprehensive approach provides valuable insights into both the theoretical principles and practical applications in the field of electronics manufacturing.
The book explores the critical role of solder in modern electronic systems, highlighting its versatility in connecting components across consumer, commercial, and military applications. It emphasizes solder's importance as the "glue" for electronic assemblies, facilitating innovative designs and advancing technology. The text notes a surge in university research and industrial development focused on improving solder materials and applications, alongside the emergence of new electronic packaging techniques. Handbooks for engineers further support this growing field.
Chapter 1 Introduction to MEMS§1.1 Introduction§1.2 Commercial Applications of
MEMS§1.3 MEMS Markets§1.4 Top 30 MEMS Suppliers§1.5 Introduction to MEMS
Packaging§1.6 MEMS Packaging Patents Since 2001§1.6.1 US MEMS Packaging
Patents§1.6.2 Japan MEMS Packaging Patents§1.6.3 Worldwide MEMS Packaging
Patents§1.7 References§Chapter 2 Advanced MEMS Packaging§2.1 Introduction§2.2
Advanced IC Packaging§2.2.1 Moore's Law vs. More Than Moore§2.2.2 3D IC
Integration and WLP§2.2.3 Low-Cost Solder Microbumps for 3D IC SiP§2.2.4
Thermal Management of 3D IC SiP with TSV§2.3 Advanced MEMS Packaging§2.3.1 3D
MEMS WLP - Designs and Materials§2.3.2 3D MEMS WLP - Processes§2.4
References§Chapter 3 Enabling Technologies for Advanced MEMS Packaging§3.1
Introduction§3.2 TSV for MEMS Packaging§3.2.1 Via formations§3.2.2 Dielectric
Isolation Layer (SiO2) Deposition§3.2.3 Barrier/Adhesion and Seed Metal Layer
Deposition§3.2.4 Via Filling§3.2.5 Cu polishing by Chemical/Mechanical polish
(CMP)§3.2.6 Fabrication of ASIC Wafer with TSV§3.2.7 Fabrication of Cap Wafer
with TSV and Cavity§3.3 Piezoresistive Stress Sensors for MEMS Packaging§3.3.1
Design and Fabrication of Piezoresistive Stress Sensors§3.3.2 Calibration of
Stress Sensors§3.3.3 Stresses in Wafers After Mounting on a Dicing Tape§3.3.4
Stresses in Wafers After Thinning (Back-Grinding)§3.4 MEMS Wafer Thinning and
Thin-Wafer Handling§3.4.1 3M Wafer Support System§3.4.2 EV Group's Temporary
Bonding and DeBonding System§3.4.3 A Simple Support-Wafer Method for Thin
Wafer Handling§3.5 Low-Temperature Bonding for MEMS Packaging§3.5.1 How Does
Low Temperature Bonding with Solders Work?§3.5.2 Low Temperature C2C
Bonding§2.5.3 Low Temperature C2W Bonding§2.5.4 Low Temperature W2W
Bonding§3.6 MEMS Wafer Dicing§3.6.1 Fundamentals of Stealth Dicing (SD)
Technology§3.6.2 Dicing of SOI Wafers§3.6.3 Dicing of Silicon-on-Silicon
Wafers§3.6.4 Dicing of Silicon-on-Glass Wafers§3.7 RoHS Compliant MEMS
Packaging§3.7.1 EU RoHS§3.7.2 What is the Definition of X-free, e.g., Pb-
free?§3.7.3 What is a Homogeneous Material?§3.7.4 What is the TAC?§3.7.5 How a
Law is Published in EU RoHS?§3.7.6 EU RoHS Exemptions§3.7.7 Current Status of
RoHS Compliance in the Electronics Industry§3.7.8 Lead-Free Solder Joint
Reliability of MEMS Packages§3.8 References§Chapter 4 Advanced MEMS Wafer
Level Packaging§4.1 Introduction§4.2 Micromachining, Wafer Bonding
Technologies and Interconnects§4.2.1 Thin Film Technologies§4.2.2 Bulk
Micromachining Technologies§4.2.3 Conventional Wafer Bonding Technologies for
Packaging§4.2.4 Plasma Assisted Wafer Bonding Technology§4.2.5 Electrical
Interconnects§4.2.6 Solder Based Intermediate Layer Wafer Bonding
Technology§4. 3 Wafer Level Encapsulation§4.3.1 High Temperature Encapsulation
Process§4.3.2 Low Temperature Encapsulation Process§4. 4 Wafer Level Chip
Capping and MCM Technologies§4. 5 Wafer Level MEMS Packaging Based on Low
Temperature Solders - Case Study§4.5.1 Case study - In/Ag system of non-
eutectic composition§4.5.2 Case study - Eutectic InSn solder for Cu/Ni/Au
based metallization§4.6 Summary and Future Outlooks§4.7 References§Chapter 5
Optical MEMS Packaging - Communications§5.1 Introduction§5.2 Actuation
Mechanisms and Integrated Micromachining Processes§5.2.1 Electrostatic
Actuation§5.2.2 Thermal Actuation§5.2.3 Magnetic Actuation§5.2.4 Piezoelectric
Actuation§5.2.5 Integrated Micromachining Processes§5.3 Optical Switches§5.3.1
Small Scale Optical Switches§5.3.2 Large Scale Optical Switches§5.4 Variable
Optical Attenuators§5.4.1 Early Development Works§5.4.2 Surface Micromachined
VOAs§5.4.3 DRIE Derived Planar VOAs Using Electrostatic Actuators§5.4.4 DRIE
Derived Planar VOAs Using Electrothermal (Thermal) Actuators§5.4.5 3-D
VOAs§5.4.6 VOAs Using Various Mechanisms§5.5 Packaging, Testing and
Reliability Issues§5.5.1 Manufacturability and Self-assembly§5.5.2 Case Study
- VOAs§5.5.3 Case Stud
