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Herbert Reichl

    Das Familienhaus
    System integration in micro electronics
    Micro-system technologies 92
    Micro-system technologies 2001
    Systemintegration in der Mikroelektronik
    Driving forces for future electronics
    • 2004

      The technical development towards mobile communication, digital edutainment and ubiquitous computing assistance is interlinked with shorter innovation cycles, global production networks, and mass consumption. This development results in a global challenge due to potentially increasing resource consumption and waste electrical and electronic equipment. Future electronic products have to be designed with minimal environmental impact for maximal user benefit. Human needs should be at the center of technology and business development. Technology is a key enabler for sustainable development. However, looking beyond technology is essential for the long-term prospect. The Proceedings of the international Symposium Electronics Goes Green 2004+ covers key topics like: * Implementation of the WEEE/RoHS* Emerging directives like EuP and REACH* Lead-free and Halogen-free technologies* Take-back logistics and Recycling* Refurbishment and ReUse* Greening the global production network and supply chain* Environmental assessment, data management and labeling* Sustainability Strategies for electronics products, services and business models.

      Driving forces for future electronics
    • 2004

      Inhalt: In diesem Tagungsband werden folgende Themen behandelt: Network, Wireless Network, Voice-over-IP, QoS, MPLS-Network, Mobile Networking, Optical Network, Broadband Access Network, Network Economics.

      Systemintegration in der Mikroelektronik
    • 2001

      In diesem Tagungsband werden u. a. folgende Themen behandelt: Mikroelektronik, Mikrotechnologie, Miniaturisierung, Automatisierung, elektronische, optische und mechanische Komponenten und Werkstoffe, Prozesssteuerung, Sensoren, Verpackungstechnik, Produktentwicklung, Fertigungstechnik.

      Micro-system technologies 2001
    • 2000

      In diesem Tagungsband werden u. a. folgende Themen behandelt: Optoelectronic Packaging, Microsystems-packaging, MEMS Packaging, RF-MEMS-Packaging, Micro-Mechatronic Integration, Microcomponents, Microsystems.

      System integration in micro electronics