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In diesem Tagungsband werden u. a. folgende Themen behandelt: Optoelectronic Packaging, Microsystems-packaging, MEMS Packaging, RF-MEMS-Packaging, Micro-Mechatronic Integration, Microcomponents, Microsystems.
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System integration in micro electronics, Herbert Reichl
- Language
- Released
- 2000
- product-detail.submit-box.info.binding
- (Paperback)
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