We have tens of thousands of books in stock.

Bookbot
The book is currently out of stock

System integration in micro electronics

Authors

More about the book

In diesem Tagungsband werden u. a. folgende Themen behandelt: Optoelectronic Packaging, Microsystems-packaging, MEMS Packaging, RF-MEMS-Packaging, Micro-Mechatronic Integration, Microcomponents, Microsystems.

Parameters

ISBN
9783800725489
Publisher
VDE-Verl.

Categories

Publication

Book purchase

The book is currently out of stock.