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Bending-stress management by stacking of ultrathin integrated circuit chips, Stefan Endler
- Language
- Released
- 2012
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- Title
- Bending-stress management by stacking of ultrathin integrated circuit chips
- Language
- English
- Authors
- Stefan Endler
- Publisher
- Der Andere Verl.
- Released
- 2012
- ISBN10
- 3862473155
- ISBN13
- 9783862473151
- Category
- University and college textbooks