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This interdisciplinary tutorial is tailored for engineers in electronic packaging. Each chapter follows a uniform format, featuring schematics, problems, and solutions, while exploring the impact of various technologies across electrical, materials, chemical, and mechanical disciplines. Led by renowned author Tummala, it offers comprehensive insights.
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Fundamentals of Microsystems Packaging, Rao Tummala
- Language
- Released
- 2001
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- (Hardcover)
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