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Focusing on power electronic packaging, this comprehensive guide explores key topics such as design, assembly, reliability, and failure analysis. It also emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for professionals and researchers in the field.
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Power Electronic Packaging, Yong Liu
- Language
- Released
- 2012
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- (Hardcover)
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- Title
- Power Electronic Packaging
- Subtitle
- Design, Assembly Process, Reliability and Modeling
- Language
- English
- Authors
- Yong Liu
- Publisher
- Springer-Verlag GmbH
- Released
- 2012
- Format
- Hardcover
- ISBN13
- 9781461410522
- Category
- Electrical engineering, Nature in general
- Description
- Focusing on power electronic packaging, this comprehensive guide explores key topics such as design, assembly, reliability, and failure analysis. It also emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for professionals and researchers in the field.