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An introduction to the Hybrid Systems-in-Foil (HySiF) concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided, several bendable electronic components are presented demonstrating the benefits of HySiF, and prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
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Hybrid Systems-in-Foil, Mourad Elsobky, Joachim N Burghartz
- Language
- Released
- 2021
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- (Paperback)
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